High power densities generate heat directly at the chips inside the rack, where power consumption and thermal load are highest. This heat spreads within the rack and must be removed reliably before it affects efficiency, operational stability or hardware lifespan.

At our booth, you will experience:

A Rear Door Heat Exchanger model demonstrating how cooling can be brought as close as possible to the heat source - enabling highly effective and scalable heat removal.

→ Targeted cooling directly at the rack, where heat is generated

AI workloads lead to highly dynamic load profiles.

If power conversion is not stable and efficient, energy losses increase invisibly.

At our booth, you will experience:

K3G630 RP3C with 7 kW a‑PFC sliding model

→ Efficient, grid‑stable power conversion under dynamic loads through active filtering of current harmonics enabled by our integrated active PFC technology.

More airflow does not automatically result in better cooling.

Pressure conditions, airflow paths and component interaction are what truly define efficiency.

At our booth, you will experience:

AxiBlade 950 perform and RadiFlow 630

→ Optimized airflow solutions for high‑performance, energy‑efficient cooling systems.

Compact fans are rarely visible, yet they significantly influence efficiency, reliability and scalability.

At our booth, you will experience:

Compact fans showcased in a compact case

→ Invisible enablers for modular designs and OEM applications.

Maximum efficiency is achieved when components are not considered in isolation, but as part of an integrated system.

At our booth, you will experience:

NEXAIRA.Systems
→ Holistic, AI-driven cooling system optimization for data centers with high energy demand

Jedes Rechenzentrum ist anders. Deshalb endet die Reise bei Ihren konkreten Anforderungen.

Am Stand erleben Sie:

Design Clinic – 15 Minuten fokussierter Engineering‑Austausch

→ keine Sales‑Slides, kein Marketing‑Pitch, sondern spezifische Insights für Ihren Use Case